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Bending aluminum base substrate

Achieving cost reduction of curved aluminum substrates using screen printing technology! Capable of various three-dimensional processing!

Our "Bendable Aluminum Base Substrate" is a substrate that can be bent and retain its shape. It allows for 3D processing using plastic processing technology without cracking the insulating layer, enhancing design and design freedom. Additionally, it simultaneously achieves high insulation breakdown voltage and low thermal resistance. 【Features】 ■ The insulating layer does not crack even with 3D processing  → Enables 3D processing using plastic processing technology ■ Bendable aluminum substrate that retains its shape  → No need for attaching heat dissipation plates ■ Simultaneously achieves high insulation breakdown voltage and low thermal resistance  → Achieves 7kV with an insulating layer of 25μm *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board

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